Sealevel has announced Modbus-SSD, a new suite of software tools designed to speed development time for embedded applications. Designed to run on Sealevel’s R9 family of rugged computing and HMI solutions, Modbus-SSD is compatible with the company’s wide range of Modbus connected distributed I/O products
HBM, Inc., a leading manufacturer of data acquisition systems, analysis and calibration software, strain gauges, transducers and sensors, announced recently that its growing line of force sensors is available with a memory module designed to store sensor properties, greatly simplifying the process of configuring a force measurement system
Tianma NLT USA has announced two new displays introduced by Tianma Micro-electronics Co. that achieve ground-breaking pixel pitch performance of 847 PPI. The new 5.2” and 10.4” units, with real 4K2K and 8K4K resolution, bring never-before-seen performance and clarity to popular smartphone and tablet display sizes. Tianma is currently exhibiting the demonstration units at Display Week 2016, Booth 905, San Francisco, California, May 24-26
Peripheral component interconnect (PCI) extensions for Instrumentation (PXI) is an open modular standard in the automated test and measurement. It offers high measurement speed, small footprint, and low power consumption compare to traditional test and measurement technique such as rack-and-stack test systems
MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic products, recently introduced the MAAP-011232, a 2-stage, 1 Watt driver amplifier featuring gain shut off and operating from 100 MHz to 3 GHz.
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