NSF Awards Tamar Technology Phase Two Funding For Silicon Wafer Research

Newbury Park, CA - Tamar Technology was awarded Phase II grant from the National Science Foundation (NSF) to continue its research into a new technology for measuring the thickness of semi-conductor silicon wafers and the depth of deep, narrow, etched trenches.

The Phase II funding is focusing on the development and commercialization of an infrared-based confocal sensor. "These sensors will support single point thickness measurements of silicon wafers with a small measurement region in a fraction of a second," says David Grant, president of Tamar Technology. "This will allow the fast mapping of wafer thickness and shape at the same time."

Measurement of deep and narrow etched trenches will also be improved. Currently, destructive measurements or expensive equipment such as transmission electron microscopes are used. Destructive testing involves cutting the sample across the trench so that the trench profile can be viewed from the side through a microscope. "This process is expensive, wasteful, and time consuming," says Grant. "Our research will produce the first cost effective, nondestructive testing method for measuring trenches directly." Tamar expects this new sensor to allow customers to increase the number of wafers inspected and improve both yields and process control by giving near real time process feedback.

The National Science Foundation is an independent federal agency created by Congress in 1950 to promote the progress of science. It funds approximately 20 percent of all federally supported basic research conducted by America's colleges and universities and is a major source of federal backing in the mathematics, computer science and the social sciences.

SOURCE: Tamar Technology