Wideband, Hybrid Power Amplifier ModulesSource: AR
New Ultra-Wide Band Hybrid Power Modules (HPM) Combine Multiple Technologies For Exceptional Performance.
Our new line of wide band, hybrid power amplifier modules (HPMs) cover the 4 to 18 GHz frequency range; and are the result of combining Microelectronic technology with the latest developments in thin film substrates. These hybrid modules require a single DC voltage source and are 50 ohm cascadable building blocks with output powers up to 5 watts. Catalog or custom designs are available. Applications requiring higher output levels and higher gain can be achieved by cascading and/or combining individual gain blocks. The modules are hermetically sealed. They pass fine and gross leak military requirements with their RF input/output connectors being field replaceable.
The six new hybrid power modules provide:
- linear output power
- ultra-compact hermetic enclosures
- excellent input and output VSWR
- excellent gain and flatness
- low noise figure
- low intermodulation distortion
- low spurious signals
- 100% load tolerance
These characteristics make the HPMs ideal for many RF applications that require linearity, power, small footprint and wide bandwidth.
Custom Hybrid Power Amplifier Designs From the MHz region to 40 GHz for Commercial and Military Applications
AR Will Custom-Design Hybrid Power Modules To Meet Your Requirements
AR is the recognized leader in designing and manufacturing RF power amplifiers. Our engineering design, knowledge and experience is utilized to provide our customers with a custom solution to meet your individual wide or narrow band power RF amplifier requirements at the component level.
Our unique blend of RF power amplifier design experience coupled with our in-house microelectronics capabilities provides our customers with unique solutions where performance, size and weight matter.
AR's in-house microelectronic capabilities utilize state-of-the art thick and thin film substrate circuitry incorporating plated-thru via holes and air bridge technology to ensure optimal RF performance. Our Microelectronics manufacturing capabilities are geared to assemble complex RF circuitry using semiconductor raw die which are eutectic-die attached and wire-bonded to the metalized ceramic substrates with other passive components surface mounted to the substrates. Special materials and process techniques are selected to achieve excellent thermal dissipation while meeting stringent military environmental testing requirements.
Our goal is to offer a solution to your most demanding requirements. Bring us your specifications and we'll work with you to create a solution. You can explore infinite possibilities with custom power RF amplifier modules for each application. And as with all AR RF/Microwave Instrumentation products you get the quality and support we are known for.
|Wideband, Hybrid Power Amplifier Modules|
|32 dBm CW||6GHz–18GHz||Model 32HM6G18–10|
|37 dBm CW||6GHz–18GHz||Model 37HM6G18-10|
|24 dBm CW||6GHz–18GHz||Model 24HM6G18-24|
|29 dBm CW||6GHz–18GHz||Model 29HM6G18-34|
|32 dBm CW||6GHz–18GHz||Model 32HM6G18-17|
|35 dBm CW||6GHz–18GHz||Model 35HM6G18-22|