Advanced Submicron Metrology Tool
Schlumberger Semiconductor Solutions provides measurement precision, even on the newest and most difficult layers, including shallow trench isolation (STI) and tungsten-plug chemical mechanical polishing (CMP) processes with small step heights within a layer and high step heights between layers with high degrees of process variation. The system's combination of optics and proprietary spatial filters enables system performance across diverse applications and processes.
The system utilizes the company's Adaptive RG metrology software to reduce ramp-up time, and assure measurement success and precision on STI processes. Designed to help customers achieve higher productivity, this algorithm accommodates process variation and accepts and rejects verification targets to achieve accurate, repeatable measurements.
A combination of the proprietary FSF focus system and the tool's new laser focusing system provides both fast and accurate measurements of overlay features. Advanced pattern recognition and a robust wafer handling system require no operator assistance during job execution.
Schlumberger Semiconductor Solutions has a mean time between failure (MTBF) of over 1800 hours with modest quarterly maintenance, ensuring optimal system availability and years of problem free operation.
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