Agilent Technologies helps solve 300mm wafer process challenges with new parameter analyzers
"Process characterization of 300mm wafers is becoming increasingly difficult, in part because of gate leakage currents on ultra-thin transistor gate oxides and low resistance measurements on copper metal structures," said Kazu Nishitsuru, marketing manager of Agilent Technologies' HSTD division. "We have enhanced the capabilities of the previous models by designing the right instrument to address the challenges of 300mm wafer test."
Enhancements include built-in quasi-static capacitance versus voltage (CV) measurement capability and a five-fold increase of voltage measurement resolution. Additionally, control of the Agilent E5250A switching matrix is now integrated into the front-panel of the 4155C and 4156C, enabling customers to create cost-effective benchtop CV-IV 300mm wafer characterization solutions.
The improved VMU measurement resolution (0.2 micro-V) of both the 4155C and 4156C also helps to solve many of the difficulties in measuring the low resistance of the copper metal systems found on most 300 mm processes. Further, Agilent introduced measurement algorithms in the new models that enable accurate femto-Amp measurements to be made even in the presence of 100 pico-Amps of leakage current.
The Agilent 4155C and 4156C both enable migration from benchtop CV-IV system to full automated CV-IV measurement on an analytical wafer prober. Algorithms created in Agilent ICS will work in Metrics I/CV, and Metrics I/CV has a soon-to-be-released Agilent FLEX-based driver that enables measurements to be made very quickly. Customers can automate both wafer prober and instruments with a single controlling PC.
Agilent is a global provider in designing and manufacturing test, measurement, and monitoring instruments, systems, and solutions, and semiconductor and optical components. The company serves markets that include communications, electronics, life sciences, and healthcare.
Agilent. Tel: 800-452-4844.
Edited by Paul O'Shea
Managing Editor, TestandMeasurement.com