Applied Materials Introduces CD-SEM for Sub-0.15 Micron Metrology

Applied Materials announces its VeraSEM system for the automated measurement and imaging of sub-0.15µ semiconductor device features. The product, a metrology SEM that extends the capabilities of a conventional CD-SEM system beyond critical dimension (CD) measurements, provides monitoring of process parameters.

The system features Process Variation Monitoring (PVM) technology that can speed customers' process development time and ensure better process control. The system is designed to handle both 200mm and 300mm wafer sizes, and is upgradable to measure sub-0.13µ geometries.

Using a column design and new algorithms, PVM technology enables vital measurements to be made on a device, including line-edge roughness, line-edge width variation, and distinguishing open/closed contact holes. These PVM features, when used in conjunction with CD measurement, can shorten the time for development and provide tighter control of lithography and etch processes.

Applied Materials, Inc. Phone: 408-563-0647