Applied Precision Adds Increased Z-Force Overtravel Capabilities To Product

Issaquah, WA - Applied Precision, LLC. announced its new High Force option for the probeWoRx 300 Probe Card Test and Analysis system.

300mm advanced probe cards are moving well past tens of thousands of pins, making the ability to maintain metrology standards under increasing Z-Force loads paramount to probe card test and analysis.

"300mm single-touch wafer-level test is driving innovative engineering solutions throughout the industry. Accommodating the greater applied loads at overtravel while maintaining accuracy and repeatability was the challenge before us," said Christian Kuwasaki, development manager for the HF. "The probeWoRx 300HF, with Z-Force levels up to 200 Kg, answers this challenge."

The ability to apply large loads utilizing probeWoRx 300HF combined with the speed improvements derived from 3-D Optical Comparative Metrology enables the cost effective testing of these increasingly larger cards while maintaining or improving throughput.

The probeWoRx 300F builds upon the advanced technology platform of 3-D Optical Comparative Metrology (3-D OCM), first introduced by Applied Precision in 2003. 3-D OCMTM technology, as opposed to traditional probe card test & analysis systems, measures probe tip planarity and alignment via complementary optical and electrical measurements to enhance speed and accuracy, while enabling new probe card metrology capabilities, such as deflection measurement and Loaded Optical Planarity. Currently, probeWoRx 300 can complete planarity and alignment tests on today's most advanced probe cards in less than one hour.

The probeWoRx 300HF adds a new dimension to Applied Precision's industry-leading family of probe card test and analysis systems, demonstrating its customer focus and dedication to the Semiconductor industry roadmap.

SOURCE: Applied Precision, LLC.