Boin GmbH releases WAFERMAP 2.3

Boin GmbH, a software manufacturer for the semiconductor industry, announces the release of version 2.3 of its metrology software WAFERMAP. The new version offers numerous new features and enhancements, such as support for new metrology file formats. In addition, the software is now released to be used under Windows XP.

WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram. Several kind of of operations can be applied to the wafer maps such as rotation, shifting of the grid in the X or Y direction, or mirroring the data along the X or Y axis. It is also possible to compare different sets of data by adding, subtracting or dividing entire wafer maps. Maps can be exported to ASCII data files.

The new WAFERMAP version now allows for importing of data files from Filmetrics and QC Solutions. With these new file formats WAFERMAP adds award winning tools and technologies to its list of supported file formats. Filmetrics designs affordable purpose-built miniature spectrometer systems with sophisticated software that integrates advanced thin-film expertise into a simple, intuitive Windows interface. These compact systems with astounding speed and accuracy have been widely recognized by the industry press. QC Solutions develops advanced epitaxial and ion implantation wafer monitoring and surface conditioning systems to enable maximum production yield. These field-proven systems allow customers to perform non-destructive, real-time process monitoring.

The WAFERMAP software is already in use on a worldwide basis at a variety of IC and semiconductor equipment companies as well as wafer suppliers and research institutes. Among IC manufacturers, the software is used during production of analog, mixed-signal, DRAM and other integrated circuits including microprocessors and communications chips for the computer and telecommunications industries. It is used for production and testing of both silicon (Si) and gallium arsenide (GaAs) integrated circuits.