Bumped Wafer Inspection System

RVSIS-2000 bumped wafer inspection system features full surface defect detection in addition to bump defect and dimensional inspection capabilities. A new laser technology allows the system to perform a full 3-D inspection at twice the previous throughput.

By providing both 2-D and 3-D inspection capabilities on the same system, the unit performs each type of critical inspection using the best and most appropriate method.

The 3-D laser technology provides accurate measurement of variables such as bump height and coplanarity. The 2-D vision technology utilizes a high-speed, high-resolution TDI camera to perform full surface defect, bump defect, and bump dimensional inspection.

The system outputs a range of data for process analysis, including per-bump data, wafer data, lot summaries and a graphic wafer map that allows viewing of trends across the wafer.

<%=company%>, 5 Shawmut Road, Canton, MA 02021, Tel: 781-821-0830, Fax: 781-828-9852