Burn-In System

Micro Control Companyigh-power burn-in system is designed to meet the challenge of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 150 watts. It provides precise, individual temperature control for each device under test while supporting a range of test strategies. The system features: individual device under test temperature control to within +3°C, 128 I/O channels per driver/receiver, programmable temperature control from 50°C to 150°C, ASIC architecture for per-pin timing, testing, and formatting, timing on the fly, programmable edges and rep-rate with 10-nanosecond resolution, 8 vector formats per pin per cycle, up to 50 A of programmable power to the device under test, a programmable clock rate from 2 to 400 MHz.

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