Cascade Microtech's new S300 RF/Microwave Probe Station ensures fast and accurate 300 mm on-wafer test

Cascade Microtech announces the release of its semi-automatic and manual S300 RF/Microwave Probing System for quick and reliable 300 mm on-wafer test and characterization. The S300 supports wafer sizes and shards from 0.5 in. (1 mm) to up to 12 in. (300mm).

This precision probing system supports the entire line of Cascade's RF/microwave probes to ensure quick set-up and reliable measurements. The S300's 2-point wafer alignment and motorized theta translates to precise, repeatable 300 mm wafer alignment.

The S300 also offers Cascade's complete microwave and thermal chuck options. It fully integrates guarded or coaxial thermal chuck heats and cools your test devices from –55C to 300C, not your 50 ohm calibration standards. The S300 also features a new independent auxiliary chucks for easy RF calibrations. These patented, thermally isolated chucks do not rotate with the chuck, maintaining critical wafer and calibration substrate alignment. The S300 also performs automatic VNA calibrations using WinCal TM Software, for the simplest, most accurate, repeatable, network-analyzer calibrations.

About Cascade Microtech, Inc.
Cascade Microtech is unparalleled in providing on-wafer high frequency and parametric test solutions. We also produce thin-film probe cards for production-level on-wafer testing. These are used to characterize most new devices in the high-speed telecommunications, SONET, and LCD market segments. Engineers use our products to develop and test integrated circuits (ICs) and opto-electronic devices. These devices are then used in consumer electronics, computers and communications products (such as cell phones, PDAs, wireless laptops, and play stations). For more information about Cascade Microtech, please visit www.cascademicrotech.com.

Source: Cascade Microtech, Inc.