Exhibiting at Nepcon West: Inspection System
Source: ERSA Inc.
The ERSASCOPE Inspection System 3000 can expand current inspection methods (X-ray, etc.) by providing the a non-destructive method to inspect for good solderability by a visual examination of hidden solder joints
ERSA Inc.PE Inspection System 3000 can expand current inspection methods (X-ray, etc.) by providing the a non-destructive method to inspect for good solderability by a visual examination of hidden solder joints. The device is a bench-top, user-friendly and safe method for inspecting all types of BGA, MicroBGA, and Flip-Chip components, in addition to many other applications.
Booth # 4018
<%=company%>, 6 Vista Drive, Old Lyme, CT 06371. Phone: 860-434-8091; Fax: 860-434-5448.
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