Interconnect Solutions
Semiconductor interconnect solutions via a family of Giga products from Johnstech International minimize the electrical distance between the device under test (DUT) and the load board. In standard Johnstech applications, the physical distance between the lead of the device under test and the load board with the Giga S test socket is reduced in length to below 4 mm. Johnstech Giga 3 and Giga BGA test sockets reduce the physical distance between the load board and the device lead or ball to below 2 mm. The reduction of both distance and the geometric contact size helps improve the overall performance of the integrated test system.
Johnstech International, 1210 New Brighton Blvd., Minneapolis MN 55413-1641. Phone: 612-378-2020; Fax: 612-378-2030.