MetaPULSE 200

Rudolph TechnologiesLSE 200 is an opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. Pattern recognition allows this product to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement.

This product can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top and buried layers, and determine material properties such as silicide phase. This provides critical information about the product's film stack.

This product uses picosecond ultrasonic laser sonar (PULSE Technology), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. The system's broad range of capabilities allows it to significantly reduce use of monitor wafers in controlling cluster tool MLM deposition.

<%=company%>, One Rudolph Road, Flanders, NJ 07836. Phone: (973) 691-1300. Fax: (973) 691-5480.