New 3M Type IV Open Top BGA Test-And-Burn-In Socket Handles Up To 961 Leads

Austin, TX - A new 0.8 mm pitch Type IV open top BGA test-and-burn-in socket family from the 3M Electronic Solutions Division handles up to 961 leads, making it one of the largest full-pattern-capable open top sockets available on the market today. The 3M Textool brand 0.8 mm Open Top BGA Test and Burn-In Socket, Type IV now accepts BGA packages on 0.8 mm pitch, with body sizes up to 27 mm x 27 mm and grid arrays up to 31 x 31, up to 961 leads. It is available in volume immediately.

Offering a 31 x 31 maximum matrix with a 961 maximum lead count enables users to switch high lead count packages from pitches such as 1.27 mm and 1.0 mm to 0.8 mm, so that package size for high end logic can be reduced without sacrificing functionality. The open top configuration can lower the cost of ownership vs. versus comparable lidded socket offerings.

The 3M Textool brand 0.8 mm Open Top BGA Test and Burn-In Socket, Type IV uses the same innovative dual-beam contact system technology as 3M's existing Open Top BGA Sockets. The newer product's design provides balanced contact in the top hemisphere of the solder ball, reducing shear stress on the solder ball and minimizing package shift during actuation. This minimizes chances for ball damage during burn-in while optimizing automated insertions.

Designed for burn-in, low speed testing, and programming of semi-conductors, its unique micro-wiping contact scrubs the oxide layer of the solder ball as well as the surface of the socket contact with each actuation to enable excellent resistance values throughout the mechanical life of the socket and also prolonging the life cycle of the socket.

For more information, visit http://www.3m.com/electronics.

SOURCE: 3M Electronics