Scanning Stepper For 200mm/300mm Lithography
Canon U.S.A. Inc., Semiconductor Equipment Division is introducing the Canon ArF excimer laser scanning stepper. The new scanner, the FPA-5000AS1, is capable of realizing 0.13 µm linewidth for 1Gb or higher DRAMs and 1GHz-class microprocessor process development on either 200mm or 300mm wafer substrates. The company will ship its first system to Japan's SELETE (Semiconductor Leading-Edge Technologies Inc.) consortium.
The new ArF scanning stepper has the same platform as the dual-era FPA-5000ES2 KrF excimer laser scanning stepper which Canon introduced recently for volume production. The platform allows easy field conversion from 200mm to 300mm wafers with a simple conversion kit.
The 200mm/300mm wafer capability of the FPA-5000AS1 gives chip makers dual, extended value from their investment by spreading the outlay across both their 200mm and their 300mm program. They can equip their R&D teams for vital work on 193-nm process evaluations down to 130nm in an existing 200mm facility, then convert the tool for 300mm service when practical.
The FPA-5000AS1 offers the performance features of the Canon 5000 Scanning System Platform-namely, enhanced vibration isolation structure; lightweight, high-speed reticle and wafer stages; and modularity.
For 193nm wavelength exposures, the FPA-5000AS1 incorporates an all-new reduction projection lens and illumination system. These 193nm optics incorporate calcium fluoride elements and aspherical surfaces to provide high-contrast imaging and low distortion. With the 0.60 NA projection lens, annular illumination and adequate resists, the AS1 enables lithography process development down to 130nm features.
The new Canon ArF system, like its full-field KrF mate, features a 4X reduction lens for single exposures over a 26 x 33mm field size. The system is designed with a large working distance from the final lens element to the photoresist's surface to avoid lens contamination caused by out-gassing from 193 nm photoresists during exposure.
Canon U.S.A., Inc., Semiconductor Equipment Div. Phone: 972-409-7800.