SensArray Introduces Process Optimization Solutions For Solder Reflow Applications
FREMONT, Calif.--(BUSINESS WIRE)--Dec. 20, 2004--
New Products Extend Advanced Temperature Measurement and Analysis Capabilities to Traditional Back-end Wafer Level Packaging Processes
SensArray(R) Corporation, an innovative provider of process optimization tools for semiconductor fabrication, today introduced two new process optimization tools for measuring real time, in situ temperature in solder reflow applications. The Process Probe(R) 1935 thermocouple (TC)-instrumented wafer and Process Probe Custom Reflow Probes were developed specifically to address the growing need for thermal measurement brought on by the introduction of no lead solder.
The move to lead-free solder in the reflow process has introduced new process monitoring issues for wafer level packaging applications. The higher melting point of no lead solder and upper temperature limitations imposed by potential heat damage to packaging components have shrunk the process window considerably. In order to ensure that the oven stays within the new, narrower temperature range, ensuring maximum output from the process, the oven manufacturer or device maker now needs to regularly measure oven temperature and uniformity. Building on proven technology, SensArray now offers instrumented wafers and other assemblies for use in measuring and maintaining uniform process results in solder reflow ovens.
The Process Probe 1935 offers highly accurate (+/- 1.5 degrees C or +/- 0.25% of reading, whichever is greatest, in isothermal chamber environment) and repeatable temperature measurements in reflow and polymer curing ovens, from 0 degrees to 350 degrees C. With up to 34 embedded thermocouple sensors, with sensor-to-sensor matching better than +/- 0.1 degrees C, users can check wafer center-to-edge thermal stresses during loading and ramping and calibrate temperature set-points in ovens with confidence.
Process Probe Custom Reflow Probes take existing SensArray technology a step further, giving package and board assemblers the option of embedding up to 34 thermocouple sensors in leadframes, strips or printed circuit boards (PCBs) for characterizing temperature profiles in ovens from 0 degrees to 400 degrees C. With Custom Reflow Probes, customers can determine edge to center temperature to adjust heater zone set points, and measure and adjust drift in temperature due to oxide build-up on the heaters and belt. Inconel sheathing on the thermocouple leads provides a close match to the thermal coefficient of expansion of the chromel and alumel wires, providing for a long thermal life cycle for the product.
Both new products complement the existing Process Probe 1630 TC-instrumented wafer that can be used in reflow and curing ovens up to 800 degrees C. All instrumented wafer are available is sizes from 50 mm to 300 mm.
"Temperature is a critical parameter in ensuring output of viable package assemblies from the reflow process. Oven settings can be delicate, and if they fall outside of the process window, valuable product can be lost," said Phil Marcoux, assembly and test business unit manager, SensArray. "Process Probe instrumented wafers, leadframes, strips and PCBs deliver highly accurate substrate and component temperature data, allowing engineers to maintain the repeatability of optimum oven settings, helping to ensure the successful outcome of the process."
The patented ThermaBond(TM) method used for embedding sensors in a re-entrant cavity in the Process Probe 1935 wafer or Custom Reflow Probe, delivers high thermal conductivity, maintains its strength at high temperatures, and is extremely tolerant of thermal shock, ensuring high measurement accuracy and reliability, especially when measuring gas injector temperatures.
Temperature measurements from Process Probe 1935 wafers and Custom Reflow Probes are acquired using wireless SensArray systems. The PDA-based Thermal TRACK(TM) measurement system presents the user with real time visual representations of the wafer temperature and uniformity measurements necessary to characterize, optimize, and maintain their equipment's thermal performance. The laptop-based Thermal MAP(R) metrology system delivers concise, informative graphic representations of temperature ramp-up, steady state, and ramp-down for rapid optimization, and powerful tools that enable run-to-run and within run analysis.
The Process Probe 1935 and Process Probe Custom Reflow Probes are currently available in the United States, Europe, and Asia. To request additional information or to order the product, please contact SensArray Corporation at 510-360-5600 or visit www.sensarray.com.
About SensArray
SensArray is an innovative provider of process optimization tools for semiconductor and flat panel fabrication. SensArray solutions for dynamic and static optimization allow manufacturers to manage equipment and processing environments, and provide increased control of critical parameters during manufacturing. By optimizing fabrication processes, SensArray products help to make processes more reliable, providing for improved output, and the more economic manufacture of high performance products.
Based in Fremont, California, SensArray is privately held and has offices in Japan, Taiwan, and Korea, with international representatives in Asia and Europe. SensArray is ISO 9001-2000 certified. For additional information about SensArray and its products, please visit www.sensarray.com.