Teradyne Ships FLEX Systems To KYEC For RF Testing

North Reading, MA - Teradyne, Inc., a world leader in economical high efficiency test, announced KYEC, a leading semiconductor test subcontractor, received delivery of multiple Teradyne FLEX test systems with the Gen4 Microwave instrumentation. The systems will support quad-site testing of leading edge cellular transceivers.

"Cellular devices are becoming more complex, creating more testing challenges. Teradyne's RF solutions offer the multisite test capability needed to meet higher throughput demand," said Gauss Chang, vice president, business center, KYEC. "We selected FLEX with Gen4 Microwave because it delivers the proven functional performance for testing a broad range of RF semiconductors and the economic benefit we can give to our customers."

The installation marks the 250^th shipment of a Gen4 Microwave option. The Gen4 Microwave instrument covers the broadest range of RF semiconductor test applications in the marketplace and enables the highest throughput through scalable multisite test. The Gen4 Microwave instrument can be configured from 4 to 38 RF ports and offers a full range of scalar and vector source and measurement capabilities. Users also have the ability to perform functional test via modulated signal generation and analysis for mainstream wireless protocol standards. Teradyne is recognized as the market leader in RF/Microwave ATE according to Gartner Dataquest's annual ATE market share report.

"As the RF semiconductor market segment continues to experience strong growth, semiconductor companies rely on Teradyne's FLEX family to deliver the broadest set of capabilities, highest throughput and fastest time to volume available in ATE," said Kyle Klatka, product manager, RF/microwave test, Teradyne. "We are very excited to reach this shipment milestone and pleased to recognize KYEC in receiving our 250th Gen4 shipment."

About FLEX Test Platform

Teradyne's FLEX Test Platform, which has surpassed its 1400^th unit shipment, advances test technologies in an architecture designed for high-efficiency, multisite test. The Platform offers multiple systems so customers can optimize for performance, configuration capacity, and capital cost to achieve the best economics of test. FLEX Platform systems span test requirements from conventional DFT and structural test to standard analog and mixed-signal to the latest high-integration System-On-a-Chip (SoC) and System-In-Package (SiP) for consumer, automotive, mass storage, wireless, and data communications applications. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

SOURCE: Teradyne, Inc.