UTAC Selects Teradyne As The Platform Of Choice For Leading Edge Wireless Device Test
NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NYSE: TER) announced that United Test and Assembly Center (UTAC) of Singapore has selected the UltraFLEX test system with Teradyne's market leading wireless instrumentation as the platform of choice for testing WLAN, cellular and Bluetooth devices.
As part of the selection, UTAC has expanded their installed base of Gen4 wireless systems with the addition of Teradyne's new UltraWave 12G wireless instrumentation. UTAC based their decision on the highly efficient multisite architecture of the UltraFLEX platform and the RF performance and universal port scalability of the UltraWave 12G RF instrumentation. Multiple UltraFLEX production systems have been installed in UTAC's Ang Mo Kio facility in Singapore.
"We are pleased to be the first OSAT (Outsource Semiconductor Assembly and Test) provider to take advantage of Teradyne's expanded suite of wireless test solutions," said CK Tan, group executive vice president of business operations at UTAC. "UTAC views Teradyne's wireless platform as a competitive advantage and a strategic tool in expanding our capabilities in the market. Our investment in the UltraWave 12G instrument prepares us to best support the next-generation of wireless device test requirements."
UltraWave 12G, which was announced by Teradyne in March, has already shipped to multiple customers and is in high volume production on multiple systems worldwide.
"We're proud that UTAC, a leading global test supplier, has chosen Teradyne as their preferred wireless test provider," said Ed Paulsen, wireless segment manager at Teradyne. "By adding UltraWave 12G to their wireless test portfolio, UTAC now has a wireless test instrument with the RF performance and port count to support the increasing performance and integration levels required for next-generation wireless device test. UTAC is now positioned to offer their customers compelling advantages in cost of test, parallel efficiency, ease of use, and performance in the rapidly evolving and high growth RF SOC market."
Teradyne's FLEX test family, with more than 1,700 test systems shipped, advances test technologies in an architecture designed for high-efficiency, multisite test. FLEX family systems readily adapt to new test requirements. With a Universal Slot architecture and high-density instrument design, test engineers can dynamically match system configurations to changing production requirements on the test floor.
Teradyne wireless device test solutions, the Gen4 Microwave and the recently introduced UltraWave 12G RF test instrument, cover the broadest range of complex wireless test requirements, including wireless LAN, Bluetooth®, set-top box (STB), cellular, WiMax and new emerging standards like Ultra Wideband.
To learn more about the FLEX test family, visit http://www.teradyne.com/flex/
About United Test and Assembly Center Ltd (UTAC)
United Test and Assembly Center Ltd (UTAC) is a leading independent provider of semiconductor assembly and testing services for a broad range of integrated circuits including memory, mixed-signal, logic and radio-frequency ICs. The Group offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising leading integrated device manufacturers (IDMs), fables companies and wafer foundries. UTAC operates manufacturing facilities in Singapore, Thailand, Taiwan and China, in addition to its global network of sales offices in the United States, Europe, Japan, Korea, China and Singapore.
About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2007, Teradyne had sales of $1.1 billion and currently employs about 3,600 people worldwide. For more information, visit www.teradyne.com. Teradyne (R) is a registered trademark of Teradyne, Inc. in the U.S. and other countries. Bluetooth® is a registered trademark of Bluetooth SIG, Inc. WiMax™ is a trademark of WiMax Forum. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).
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