Vertical Thermal Shock Chambers (Air-to-Air)
Unique chamber designs pay particular attention to air flow, passing equal volumes of conditioned air over the products, resulting in rapid product temperature changes. The thermal stresses induced precipitate hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
The VTS Air-to-Air Thermal Shock Chambers are designed to perform tailored environmental stress screening of component and board level electronic assemblies. The VTS Chamber will also perform as a fully functional, independent environmental test chamber.
The VTS-Series Chambers can be specially designed to meet the unique requirements of the following specifications: MIL-STD 883C, Methods 1010.5 and 1010.7; MIL-STD 202F, Method 107G; and MIL-STD 810D, Method 503.2.
<%=company%>, 12011 Mosteller Rd. Cincinnati, OH 45241-1528. TEL: 513-772-8810; FAX: 513-772-9119.