Product/Service

Wafer Probing System

Source: Electroglas, Inc.
The EG4|200 automatic wafer probing system is suited for high probe loads of leading edge multi-die and bumped wafer applications
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Electroglas, Inc. automatic wafer probing system is suited for high probe loads of leading edge multi-die and bumped wafer applications. Built on the Horizon platform, the system combines high force with low deflection and high speed stepping to provide accurate touchdowns even on high pin count, high force applications. It features 150 kg of low deflection die-centered probe force for accurate and reliable contact. It is fully compatible with SORTnet information management products for robust communications with factory control and yield management systems.
EGCommander Plus Windows NT-based interactive system software for probing process customization and optimization is also included.

<%=company%>, 2901 Coronado Dr., Santa Clara, Ca 95054. Phone: 408-727-6500; Fax: 408-982-8025.