Business Wire
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Agilent Technologies Announces HiSIM_HV Model Extraction Package For IC-CAP
9/22/2008
Agilent Technologies Inc. today announced the release of the HiSIM_HV Model Extraction Package for advanced high voltage metal oxide semiconductor (HVMOS) device models
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Eagle Test Systems Selects Camstar’s Enterprise Manufacturing And Quality Execution Platform
9/18/2008
Camstar Systems, Inc., today announced that Eagle Test Systems, Inc. (Nasdaq: EGLT), a provider of automated test equipment solutions for high-performance analog, mixed-signal and radio frequency (RF) semiconductors, has selected Camstar’s Electronics Suite to increase visibility and traceability across manufacturing processes and to support yield and quality improvements
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Agilent Technologies' All-In-One MIPI D-PHY Test Platform Selected By ST Microelectronics
9/17/2008
Agilent Technologies Inc. today announced that ST Microelectronics has selected Agilent’s physical layer sink test solution to test its devices according to the MIPI D-PHY standard
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Semilab Licenses Implant And Metal Thickness Metrology Technology From Applied Materials
9/17/2008
Semilab Co. Ltd., announced today that it has licensed key patents and transferred relevant know-how from Applied Materials, Inc. The acquired intellectual property (IP) covers technology and systems used in semiconductor applications for measuring implant and metal thickness
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Luna Technologies Releases Next Generation Precision Reflectometer For Increased Throughput In Optical Manufacturing
9/16/2008
Luna Technologies, a division of Luna Innovations Incorporated, will demonstrate an economical, ultra-high resolution reflectometer, the PR 4400, at the 2009 European Conference on Optical Communication (ECOC)
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LeCroy Introduces New WaveAce Oscilloscopes For Simple, Fast And Efficient Debug
9/15/2008
Leroy Corporation introduces the WaveAce series of digital oscilloscopes that expands its line of portable, affordable and easy to use oscilloscopes in the 60 MHz to 300 MHz range
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Intellitech Speeds Concurrent Test Of JTAG Based Electronics With New Mercury Remote Diagnostic Manager
9/9/2008
Intellitech Corporation, has announced the Mercury Remote Diagnostic Manager (MRDM) for production or burn-in test. The MRDM increases tester throughput by enabling the tester to perform back-to-back testing without the need to stop to perform diagnostics on failing UUTs
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SUSS MicroTec Announces 300 mm ProbeShield System Order
9/4/2008
SUSS MicroTec Test Systems has announced that it has received an order for the PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test, from a major Asian semiconductor memory manufacturer
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Teradyne, Inc. To Acquire Eagle Test Systems, Inc.
9/3/2008
Teradyne, Inc. and Eagle Test Systems, Inc. announced that they have signed a definitive agreement under which Teradyne will acquire Eagle Test. Teradyne is a world leader in System-On-a-Chip (SOC) semiconductor test, while Eagle Test is a leading provider of analog, mixed-signal and radio frequency semiconductor test products.
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Digital Lightwave Announces New Ethernet Services Analyzer Module
9/3/2008
Digital Lightwave, Inc., a leading provider of optical networking test equipment and technology, today announced the ESA 2025 Module for the NIC Platform. The new Ethernet Services Analyzer module provides industry-leading Ethernet testing with unmatched flexibility to expand testing capabilities as the customers’ needs change
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