Business Wire

  1. Eagle Test Systems Selects Camstar's Enterprise Manufacturing And Quality Execution Platform 9/18/2008
    Camstar Systems, Inc., today announced that Eagle Test Systems, Inc. (Nasdaq: EGLT), a provider of automated test equipment solutions for high-performance analog, mixed-signal and radio frequency (RF) semiconductors, has selected Camstar’s Electronics Suite to increase visibility and traceability across manufacturing processes and to support yield and quality improvements
  2. Agilent Technologies' All-In-One MIPI D-PHY Test Platform Selected By ST Microelectronics 9/17/2008
    Agilent Technologies Inc. today announced that ST Microelectronics has selected Agilent’s physical layer sink test solution to test its devices according to the MIPI D-PHY standard
  3. Semilab Licenses Implant And Metal Thickness Metrology Technology From Applied Materials 9/17/2008
    Semilab Co. Ltd., announced today that it has licensed key patents and transferred relevant know-how from Applied Materials, Inc. The acquired intellectual property (IP) covers technology and systems used in semiconductor applications for measuring implant and metal thickness
  4. Luna Technologies Releases Next Generation Precision Reflectometer For Increased Throughput In Optical Manufacturing 9/16/2008
    Luna Technologies, a division of Luna Innovations Incorporated, will demonstrate an economical, ultra-high resolution reflectometer, the PR 4400, at the 2009 European Conference on Optical Communication (ECOC)
  5. LeCroy Introduces New WaveAce Oscilloscopes For Simple, Fast And Efficient Debug 9/15/2008
    Leroy Corporation introduces the WaveAce series of digital oscilloscopes that expands its line of portable, affordable and easy to use oscilloscopes in the 60 MHz to 300 MHz range
  6. Intellitech Speeds Concurrent Test Of JTAG Based Electronics With New Mercury Remote Diagnostic Manager 9/9/2008
    Intellitech Corporation, has announced the Mercury Remote Diagnostic Manager (MRDM) for production or burn-in test. The MRDM increases tester throughput by enabling the tester to perform back-to-back testing without the need to stop to perform diagnostics on failing UUTs
  7. SUSS MicroTec Announces 300 mm ProbeShield System Order 9/4/2008
    SUSS MicroTec Test Systems has announced that it has received an order for the PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test, from a major Asian semiconductor memory manufacturer
  8. Teradyne, Inc. To Acquire Eagle Test Systems, Inc. 9/3/2008
    Teradyne, Inc. and Eagle Test Systems, Inc. announced that they have signed a definitive agreement under which Teradyne will acquire Eagle Test. Teradyne is a world leader in System-On-a-Chip (SOC) semiconductor test, while Eagle Test is a leading provider of analog, mixed-signal and radio frequency semiconductor test products.
  9. Digital Lightwave Announces New Ethernet Services Analyzer Module 9/3/2008
    Digital Lightwave, Inc., a leading provider of optical networking test equipment and technology, today announced the ESA 2025 Module for the NIC Platform. The new Ethernet Services Analyzer module provides industry-leading Ethernet testing with unmatched flexibility to expand testing capabilities as the customers’ needs change
  10. setcom Wireless Announces Single Test System For Entire LTE Lifecycle 9/3/2008
    setcom wireless announced its S-CORE conformance and research test environment for LTE (Long Term Evolution) protocol testing and monitoring. S-CORE is an innovative protocol tester for LTE signaling designed from the ground up to be easy to use, provide clearer diagnostic information, and leverage off-the-shelf hardware to reduce capital expense