Business Wire
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MRV Announces All Optical 100 Gbps Cross Connect For Test Lab Automation
8/13/2008
MRV COMMUNICATIONS, INC., a leading provider of products and services for out-of-band networking, optical transport, metro Ethernet, and fiber optic components today announced the Optical Cross Connect 320 (OCC 320), a new high data-rate, all optical physical layer switch as the latest member of its family of test automation products (TAP) for automating network equipment test environments
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Data Translation Lowers Entry Price For High Accuracy Temperature Measurement Instruments
7/31/2008
Data Translation announces lower cost versions of its popular TEMPpoint™ temperature measurement instrument. TEMPpoint now offers customers an 8-channel entry level version that can be easily extended to 16, 24, 32, 40, or 48 channels over time. This modularity allows customers to upgrade their system as needed while keeping their entry-level costs low
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Ixia And QualiSystems Integrate To Advance IP Test Automation
7/29/2008
Ixia™, a leading global provider of IP performance test systems today announced that it has formed a strategic partnership with QualiSystems, a pioneer in the field of Test Automation, to integrate Ixia’s Test Conductor™ IP test automation framework with QualiSystems’ TestShell™ suite of vendor independent test applications
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Teradyne Introduces The IP750Ex For Image Sensor Device Test
7/28/2008
Teradyne, Inc. announced that Hynix Semiconductor, Inc., Icheon-si, Kyoungki-do Korea, has launched the production of their first CMOS image sensor using the new Teradyne IP750Ex™ test system for wafer testing
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UTAC Selects Teradyne As The Platform Of Choice For Leading Edge Wireless Device Test
7/27/2008
Teradyne, Inc. announced that United Test and Assembly Center (UTAC) of Singapore has selected the UltraFLEX test system with Teradyne’s wireless instrumentation as the platform of choice for testing WLAN, cellular and Bluetooth devices
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Agilent Technologies, picoChip, mimoOn Demonstrate 3GPP LTE Femtocell Testing Capability
7/22/2008
Agilent Technologies Inc. today announced that engineers from Agilent, picoChip and mimoOn have successfully tested a 3GPP LTE femtocell reference design using Agilent’s MXA signal analyzer VSA test solutions
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Rudolph's Next-Generation PrecisionWoRx VX4 Extends The Capabilities Of Leading Probe Card Test And Analysis Tool
7/15/2008
Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for both front-end and back-end inspection and metrology solutions, today announced the PrecisionWoRx™ VX4, the next generation of its market-leading probe card test and analysis tools
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KTEI V7.1 Upgrade For Model 4200-SCS Semiconductor Characterization System Expands C-V, I-V, And Pulsed I-V Characterization
7/15/2008
Keithley Instruments, Inc., a leader in solutions for emerging measurement needs, has introduced Keithley Test Environment Interactive (KTEI) V7.1 for the company’s award-winning Model 4200-SCS Semiconductor Characterization System
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Hana Micron Buys Verigy Port Scale RF Solution To Meet Customer Demand For Testing Wireless Consumer Devices
7/10/2008
Verigy, a premier semiconductor test company, today announced that Hana Micron Inc., a leading Korea-based company specializing in the assembly and test of semiconductor packages and modules, has selected the Verigy Port Scale RF solution for testing their IDM and fabless customers’ consumer wireless devices
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Asahikasei EMD First To Select Teradyne's New UltraFLEX-HD Test System With UltraPin800 And UltraWave12G Instrumentation Suite
7/10/2008
Teradyne, Inc. announced today that Asahikasei EMD(AKEMD), the world’s premier supplier of audio ICs for professional and consumer markets, has purchased several new UltraFLEX-HD™ systems for testing RF SOC devices
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